Laser Shearography uses the coherent and monochromatic properties of laser light to illuminate the surface of a component under investigation.
The lights reflected by the component surface will generate a speckle pattern. This speckle pattern is then recorded by a digital camera and converted into an image using Fourier analysis
When the component is stressed e.g., by a mechanical load, thermal heating, etc., the speckle pattern will change accordingly as the component deforms. By recording the new speckle pattern and converting into an image by Fourier analysis and subtracting it from the original speckle pattern, a fringe pattern will be produced and can be displayed on a computer screen
This fringe pattern contains information about the relative deformation of the component between its two states (before and after stress).
When there are no features within the component, a regular fringe pattern (usually in the form of uniformly distributed fringes) will be obtained. When there is a subsurface feature such as crack, the regular fringe pattern will be disturbed.
This enables the defect to be identified by the operator Therefore, using this device, defects that are on the back and invisible areas of parts in different shapes and sizes can be identified and measured with sufficient accuracy.
Laser type | Diode laser, 120 mw, 600 nm |
CCD-resolution | 1500*1100 pixels |
Loading unit | Thermal lamp 2000 w |
Working distance | 30-100 cm (other size can be customized) |
Operation modes | Manual, 2D and 3D operation |
Date interface | TIFF, ASCII |
Date acquisition speed | Online Measurement & 60 sec per inspections |
Dimensions of sensor head | 40 cm*15 cm*15 cm (without illumination arms) |
Dimensions of control unit | 110 cm*60 cm*60 cm |
Weight | 5 kg (sensor) |
Control and evaluation unit | Portable head with controller unit |
Operation system | Windows 7 |
Technical Data Sheet Technical Data Sheet Popular | 03/08/1400 20:21:15 341.7 KB | |